| Year | 2013 |
|---|---|
| Authors | Jen-Ching Huang 1, 2 a, Yi-Chia Liao3, Huail-Siang Liu3 and Fu-Jen Cheng4 |
| Paper Title | The Study on Deposition Process and Mechanical Properties of Deposited Cu Thin Films Using Molecular Dynamics |
| Journal Title | Advanced Materials Research |
| Vol.No | 684 |
| Issue.No | 2013 |
| Paper Type | EI |
| Date of Publication | 2013-09-01 |